依據歐盟施行的個人資料保護法，我們致力於保護您的個人資料並提供您對個人資料的掌握。
按一下「全部接受」，代表您允許我們置放 Cookie 來提升您在本網站上的使用體驗、協助我們分析網站效能和使用狀況，以及讓我們投放相關聯的行銷內容。您可以在下方管理 Cookie 設定。 按一下「確認」即代表您同意採用目前的設定。
Memory
■ FC-BOC
Memory IC substrate used on personal computers or electronic communication products.
■ LGA
The handheld device is equipped with a multi-chip stacked embedded memory module.
■ POP
Memory packaging substrates for smartphones, tablets and mobile devices are used in conjunction with 2D packaging for application processors or baseband chipsets.
■ eMMC/eMCP
IC substrate used for flash memory in smartphones and tablets.
Memory IC substrate used on personal computers or electronic communication products.
■ LGA
The handheld device is equipped with a multi-chip stacked embedded memory module.
■ POP
Memory packaging substrates for smartphones, tablets and mobile devices are used in conjunction with 2D packaging for application processors or baseband chipsets.
■ eMMC/eMCP
IC substrate used for flash memory in smartphones and tablets.
Vendor：SIMMTECH
Country：Korea
Jack Lai
E-mail: jack_lai@niching.com.tw
TEL: 886-3-6116888 ext.62521